Suzhou Electric Appliance Research Institute
期刊號: CN32-1800/TM| ISSN1007-3175

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大容量氣體絕緣開關(guān)設(shè)備散熱技術(shù)研究

來源:電工電氣發(fā)布時(shí)間:2018-08-16 13:16 瀏覽次數(shù):756
大容量氣體絕緣開關(guān)設(shè)備散熱技術(shù)研究
 
湯清雙1,2,李猛1,2,李鵬1,2,鄭曉果1,2,楊鎮(zhèn)寧1,2
(1 許繼集團(tuán)有限公司,河南 許昌 461000;2 許昌許繼德理施爾電氣有限公司,河南 許昌 461000)
 
    摘 要:為解決大容量開關(guān)設(shè)備溫升問題,進(jìn)行溫升與散熱技術(shù)研究具有重要意義。分析了開關(guān)設(shè)備的發(fā)熱原因,并對內(nèi)部導(dǎo)體進(jìn)行了載流量計(jì)算,分別從熱傳導(dǎo)、熱對流、熱輻射三方面對開關(guān)設(shè)備進(jìn)行散熱設(shè)計(jì),并給出多種散熱方案,通過FLOEFD 熱分析計(jì)算軟件計(jì)算出每種散熱方案的散熱效果,結(jié)合經(jīng)濟(jì)性、工藝性進(jìn)行擇優(yōu)選擇。將選出的散熱方案應(yīng)用于開關(guān)設(shè)備,順利通過了溫升試驗(yàn),為開關(guān)設(shè)備結(jié)構(gòu)優(yōu)化和散熱設(shè)計(jì)提供了理論支撐。
    關(guān)鍵詞:載流量;集膚效應(yīng);散熱設(shè)計(jì);熱仿真分析;溫升試驗(yàn)
    中圖分類號:TM591     文獻(xiàn)標(biāo)識碼:A     文章編號:1007-3175(2018)08-0025-05
 
Research on Heat Dissipation Technology of Large Capacity Gas Insulated Switching Equipment
 
TANG Qing-shuang1,2, LI Meng1,2, LI Peng1,2, ZHENG Xiao-guo1,2, YANG Zhen-ning1,2
(1 Xuji Group Corporation, Xuchang 461000, China;2 XJ-Driescher Wegberg Electric Co., Ltd, Xuchang 461000, China)
 
    Abstract: In order to solve the temperature rise problem of large capacity switching equipment, it is significant to carry out the research on the temperature rise and dissipation technology. This paper analyzed the heating source of switching equipment and carried out the carrying capacity calculation of internal conductor. The heat dissipation design was carried out from three aspects including heat conduction, heat convection and thermal radiation. A variety of cooling solutions were given. FLOEFD thermal analysis software was used to calculate the heat dissipation effect of each heat dissipation scheme. In combination with the economy and process of each heat dissipation scheme, the preferred choice was made. The selected heat dissipation scheme was applied to the switching equipment so that the temperature rise test successfully passed, which provides the theoretical support for the structure optimization and heat dissipation design of the switching equipment.
    Key words: carrying capacity; skin effect; thermal design; thermal simulation analysis; temperature rise test
 
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